Всего результатов: 184
Страницы
Изобр. | Партномер | Производитель | Описание | Datasheet | RoHS | Габариты | Рабочее напряжение питания | Номинальная мощность | Быстродействие | Поток воздуха | Тип подшипника | Серия |
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conga-B7XD/CSA-HP-B | congatec | Системы охлаждения для ЦП и чипов Standard active cooling solution for high performance COM Express Type 7 module conga-TSXD with integrated heat pipes, 70mm radial 12V PWM fan and 30mm overall heat sink height. All standoffs are M2.5mm thread. | Нет | conga-B7XD | ||||||||
conga-PA5/CSP-T | congatec | Системы охлаждения для ЦП и чипов Passive cooling solution for conga-PA5 based on open silicon Pentium and Celeron processors and heat sink with 12mm heatsink fins. All standoffs are with 2.7 mm threaded hole. | Нет | conga-PA5 | ||||||||
conga-PA5/i-CSP-T | congatec | Системы охлаждения для ЦП и чипов Passive cooling solution for conga-PA5 based on lidded Atom E3900 processors with 12mm heatsink fins. All standoffs are with 2.7 mm threaded hole. | Нет | conga-PA5 | ||||||||
conga-IA5/CSP | congatec | Системы охлаждения для ЦП и чипов Passive cooling solution for conga-IA5 based on open silicon Pentium and Celeron processors with 12mm heatsink fins. | Нет | conga-IA5 | ||||||||
conga-IA5/i-CSP | congatec | Системы охлаждения для ЦП и чипов Passive cooling solution for conga-IA5 based on lidded Atom E3900 processors with 12mm heatsink fins. | Нет | conga-IA5 | ||||||||
conga-TR3/CSP-HP-B | congatec | Системы охлаждения для ЦП и чипов Standard passive cooling solution for high performance COM Express module conga-TR3 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole. | Нет | conga-TR3 | ||||||||
conga-TR3/CSP-HP-T | congatec | Системы охлаждения для ЦП и чипов Standard passive cooling solution for high performance COM Express module conga-TR3 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All standoffs are M2.5mm thread. | Нет | conga-TR3 | ||||||||
conga-TR3/CSA-HP-B | congatec | Системы охлаждения для ЦП и чипов Standard active cooling solution for high performance COM Express module conga-TR3 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. | Нет | conga-TR3 | ||||||||
conga-TR3/CSA-HP-T | congatec | Системы охлаждения для ЦП и чипов Standard active cooling solution for high performance COM Express module conga-TR3 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. | Нет | conga-TR3 | ||||||||
conga-B7AC/CSA-Cu-B | congatec | Системы охлаждения для ЦП и чипов Standard active cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins, 20mm overall heat sink height and integrated 12V fan. Intended for modules with TDP up to 17W * Cu = | Нет | 12 V | conga-B7AC | |||||||
conga-B7AC/CSA-Cu-T | congatec | Системы охлаждения для ЦП и чипов Standard active cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins, 20mm overall heat sink height and integrated 12V fan. Intended for modules with TDP up to 17W * Cu = | Нет | 12 V | conga-B7AC | |||||||
conga-B7AC/CSA-VC-B | congatec | Системы охлаждения для ЦП и чипов Standard active cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated vapor chamber, 15mm fins, 20mm overall heat sink height and integrated 12V fan. Intended for modules with TDP | Нет | 12 V | conga-B7AC | |||||||
conga-B7AC/CSA-VC-T | congatec | Системы охлаждения для ЦП и чипов Standard active cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated vapor chamber, 15mm fins, 20mm overall heat sink height and integrated 12V fan.Intended for modules with TDP | Нет | 12 V | conga-B7AC | |||||||
conga-B7AC/CSP-Cu-B | congatec | Системы охлаждения для ЦП и чипов Standard passive cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins and 20mm overall heat sink height. Intended for modules with TDP up to 17W * Cu = copper plate * B = | Нет | conga-B7AC | ||||||||
conga-B7AC/CSP-Cu-T | congatec | Системы охлаждения для ЦП и чипов Standard passive cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins and 20mm overall heat sink height. Intended for modules with TDP up to 17W * Cu = co | Нет | conga-B7AC | ||||||||
conga-B7AC/CSP-VC-B | congatec | Системы охлаждения для ЦП и чипов Standard passive cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated vapor chamber, 15mm fins and 20mm overall heat sink height. Intended for modules with TDP higher than 17W * | Нет | conga-B7AC | ||||||||
conga-B7AC/CSP-VC-T | congatec | Системы охлаждения для ЦП и чипов Standard passive cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated vapor chamber, 15mm fins and 20mm overall heat sink height. Intended for modules with TDP higher than 17W * | Нет | conga-B7AC | ||||||||
conga-QMX8/CSP-B | congatec | Системы охлаждения для ЦП и чипов Passive cooling solution for Qseven module conga-QMX8 with lidded NXP i.MX8 ARM Cortex A72 processor. All standoffs are M2.5mm thread. | Нет | conga-QMX8 | ||||||||
conga-QMX8/CSP-T | congatec | Системы охлаждения для ЦП и чипов Passive cooling solution for Qseven module conga-QMX8 with lidded NXP i.MX8 ARM Cortex A72 processor. All standoffs are with 2.7mm bore hole. | Нет | conga-QMX8 | ||||||||
conga-SMX8/i-CSP-B | congatec | Системы охлаждения для ЦП и чипов Pico-ITX chassis with passive cooling for conga-PA5 with non-lidded Intel Celeron and Pentium processors with IO shield, LED's, power button, 2x USB 2.0, 2.5" HDD mount, 2x antenna holes, 1x UART hole, VESA mounti | Нет | conga-SMX8 | ||||||||
conga-TC87/CSA-B | congatec | Системы охлаждения для ЦП и чипов Standard active cooling solution for COM Express modules conga-TC87. All standoffs are with 2.7mm bore hole, 13mm fins, 23mm overall heat sink height and integrated 12V fan. | Нет | conga-TC87 | ||||||||
conga-TC87/CSA-T | congatec | Системы охлаждения для ЦП и чипов Standard active cooling solution for COM Express modules conga-TC87. All standoffs are M 2.5 threaded, 13mm fins, 23mm overall heat sink height and integrated 12V fan. | Нет | conga-TC87 | ||||||||
conga-TR4/CSA-HP-B | congatec | Системы охлаждения для ЦП и чипов Standard active cooling solution for high performance COM Express module conga-TR4 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. | Нет | 12 V | conga-TR4 | |||||||
conga-TR4/CSA-HP-T | congatec | Системы охлаждения для ЦП и чипов Standard active cooling solution for high performance COM Express module conga-TR4 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. | Нет | 12 V | conga-TR4 | |||||||
conga-TR4/CSP-HP-B | congatec | Системы охлаждения для ЦП и чипов Standard passive cooling solution for high performance COM Express module conga-TR4 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole. | Нет | conga-TR4 |